Find a Tender
complete
Official procurement procedure
UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components
Microelectronic machinery and apparatus and microsystems
Published value
Not published
Submission deadline Not published
Lots published1
Procurement Executive Summary
AI & Search Synopsis
Generated from official OCDS record
Tenderline Synopsis: UK Research & Innovation: "UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components". Published status: complete. Published value: Value not published. 1 published lot. Submission deadline not published. See the official notice for participation instructions.
| Contracting Authority | UK Research & Innovation | Scope & Categories | Not published | Submission Window | complete No deadline published |
|---|---|---|---|---|---|
| Submission Gateway | Direct notice route | Legal Basis & Regime | Standard procurement | Estimated Value (exc. VAT) | Not published |
Bidder Intelligence · Authority Profile: UK Research & Innovation
Market Analytics
Derived from OCDS awards & bid statistics
Published history for UK Research & Innovation. These figures describe retained records, not a forecast of bids or a measure of buyer bias.
Average Price Reduction
Not availableInsufficient comparable data
Competition Density
1Bids / Report
Supplier ConcentrationNo estimate
Insufficient attributable awardsNo concentration estimate availablePayment Terms
Check noticePublished terms
Coverage: 1 active published awards; 1 bid reports (which may be per lot). Supplier values exclude multi-supplier awards, frameworks and DPS, and use GBP only. They are published award values, not payments. Price reduction compares single-lot, single-award, single-supplier GBP procedures with explicitly non-framework/non-DPS status; increases remain in the average. Unpublished data stays unknown. Awarded suppliers are winners, not all bidders.
Procedure terms
Contracting AuthorityUK Research & Innovation | Procedure methodNot published | Procurement categoryNot published |
Statuscomplete | Framework / DPSNot published | CompetitionNot published |
Above thresholdNot published | Legal basisNot published | Tender period startsNot published |
Clarification deadlineNot published | Electronic submissionNot published | Submission languagesNot published |
Published15 Feb 2024, 16:05 GMT | Last source update15 Feb 2024, 16:05 GMT | Recurring procurementNot published |
ClassificationMicroelectronic machinery and apparatus and microsystems | ||
Delivery area | ||
OCIDocds-h6vhtk-043a8b | ||
What is being bought
UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.
What changed
From the official release history
- Status changed to complete
15 Feb 2024, 16:05 GMT - Official notice release published
15 Feb 2024, 16:05 GMT - Buyer information updated
15 Feb 2024, 16:05 GMT
Lots and requirements (1)
Published by the contracting authority
- Lot 1 · #1Individual lot title not publishedcancelledPublished valueNot publishedUK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) had a requirement for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic.Contract periodNot publishedEligibilityNot publishedOptions / renewalNot published
Timeline
- Procedure published
15 Feb 2024, 16:05 GMT - Award active
Not published · Not published - Contract active
Signed 13 Feb 2024, 00:00 GMT · £250,000
Commercial outcome and competition
Awards Inseto (UK) Limited Not published · Not published · active |
Contracts Contract £250,000 · signed 13 Feb 2024, 00:00 GMT · active |
Bid statistics bids: 1 (lot 1) |
Buyer and organisations in this procedure
UK Research & Innovation
Contracting authority GB-FTS-105206Documents (0)
Official links; attachments are not copied
No linked documents are published
Related procedures (0)
No related procedures published
Planning and rationale
Planning budgetNot published |
No-engagement rationaleNot published |
Procedure rationaleThe original tender was terminated due to no compliant bids being received. Therefore we went down the negotiated procedure route and found a suitable quotation for the work needing to be carried out. |