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Official procurement procedure
Supply of Semiconductor Dicing and Grinding Systems
Laboratory
optical and precision equipments (excl. glasses)
Published value
Not published
Submission deadline Not published
Lots published2
Procurement Executive Summary
AI & Search Synopsis
Generated from official OCDS record
Tenderline Synopsis: Swansea University: "Supply of Semiconductor Dicing and Grinding Systems". Published status: complete. Published value: Value not published. 2 published lots. Submission deadline not published. See the official notice for participation instructions.
| Contracting Authority | Swansea University | Scope & Categories | Not published | Submission Window | complete No deadline published |
|---|---|---|---|---|---|
| Submission Gateway | Direct notice route | Legal Basis & Regime | Standard procurement | Estimated Value (exc. VAT) | Not published |
Bidder Intelligence · Authority Profile: Swansea University
Market Analytics
Derived from OCDS awards & bid statistics
Published history for Swansea University. These figures describe retained records, not a forecast of bids or a measure of buyer bias.
Published-to-award variance
Not availableInsufficient comparable data
Competition Density
2Bids / Report
Supplier ConcentrationNo estimate
Insufficient attributable awardsNo concentration estimate availablePayment Terms
Check noticePublished terms
Coverage: 9 active published awards; 9 bid reports (which may be per lot). Supplier values exclude multi-supplier awards, frameworks and DPS, and use GBP only. They are published award values, not payments. Published-to-award variance compares single-lot, single-award, single-supplier GBP procedures with explicitly non-framework/non-DPS status; increases remain in the average. Unpublished data stays unknown. Awarded suppliers are winners, not all bidders.
Procedure terms
Contracting AuthoritySwansea University | Procedure methodNot published | Procurement categoryNot published |
Statuscomplete | Framework / DPSNot published | CompetitionNot published |
Above thresholdNot published | Legal basisNot published | Tender period startsNot published |
Clarification deadlineNot published | Electronic submissionNot published | Submission languagesNot published |
Published8 Nov 2021, 15:35 GMT | Last source update8 Nov 2021, 15:35 GMT | Recurring procurementNot published |
ClassificationLaboratory, optical and precision equipments (excl. glasses) | ||
Delivery area | ||
OCIDocds-h6vhtk-02cb8f | ||
What is being bought
This Tender Specification is for the supply and installation of a Wafer Dicing System and a Wafer Grinding System. These systems will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility.
This requirement is split into two separate lots
What changed
From the official release history
- tender value changed
8 Nov 2021, 15:35 GMT - Status changed to complete
8 Nov 2021, 15:35 GMT - Official notice release published
8 Nov 2021, 15:35 GMT - Submission deadline changed to published date
8 Nov 2021, 15:35 GMT - Published value updated to £350,000
23 Jul 2021, 09:05 BST - Status changed to active
23 Jul 2021, 09:05 BST - Official notice release published
23 Jul 2021, 09:05 BST - Submission deadline changed to 24 Aug 2021, 12:00 BST
23 Jul 2021, 09:05 BST - Buyer information updated
23 Jul 2021, 09:05 BST
Lots and requirements (2)
Published by the contracting authority
- Lot 1 · #1Wafer Dicing SystemcancelledPublished valueNot publishedThis Tender Specification is for the supply and installation of a Wafer Dicing System and a Wafer Grinding System. These systems will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility. Additional information: Funding for this procurement has been secured from the Driving the Electric Revolution (DER) Industrialisation Centres Programme via Innovate UK.Contract periodNot publishedEligibilityNot publishedOptions / renewalNot published
- Lot 2 · #2Wafer Grinding SystemcancelledPublished valueNot publishedThis procurement is for the supply and installation of a Wafer Grinding System. This will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility. Additional information: Funding for this procurement has been secured from the Driving the Electric Revolution (DER) Industrialisation Centres Programme via Innovate UK.Contract periodNot publishedEligibilityNot publishedOptions / renewalNot published
Timeline
- Procedure published
8 Nov 2021, 15:35 GMT - Award active
Not published · Not published - Award active
Not published · Not published - Contract active
Signed 19 Oct 2021, 00:00 BST · £103,982 - Contract active
Signed 19 Oct 2021, 00:00 BST · £278,592
Commercial outcome and competition
Awards Disco HI-TEC UK LTD Not published · Not published · active Disco HI-TEC UK LTD Not published · Not published · active |
Contracts Wafer Dicing System £103,982 · signed 19 Oct 2021, 00:00 BST · active Wafer Grinding System £278,592 · signed 19 Oct 2021, 00:00 BST · active |
Bid statistics bids: 2 (lot 1) electronicBids: 2 (lot 1) foreignBidsFromEU: 2 (lot 1) foreignBidsFromNonEU: 0 (lot 1) smeBids: 0 (lot 1) bids: 1 (lot 2) electronicBids: 1 (lot 2) foreignBidsFromEU: 1 (lot 2) foreignBidsFromNonEU: 0 (lot 2) smeBids: 0 (lot 2) |
Buyer and organisations in this procedure
Swansea University
Contracting authority GB-FTS-177Documents (0)
Official links; attachments are not copied
No linked documents are published
Related procedures (0)
No related procedures published