Official UK procurement notice
Supply of Semiconductor Dicing and Grinding Systems
Authority: Swansea University (Education)
What is being bought2 lots · detail below
Published requirement descriptionThis Tender Specification is for the supply and installation of a Wafer Dicing System and a Wafer Grinding System. These systems will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility.
This requirement is split into two separate lots
CPV: Laboratory, optical and precision equipments (excl. glasses)
Lots and requirements (2)Procurement structure
2 lots · all with a published value (£330,000 together) · same evaluation weights on every lotLot #1Wafer Dicing SystemAwardedPublished value£80,000
Lot #2Wafer Grinding SystemAwardedPublished value£250,000
This procurement is for the supply and installation of a Wafer Grinding System. This will be of strategic importance in expanding the capabilities that the CISM will be able to provide, and reliability of the equipment is paramount to maintaining and supporting the wide array of experimental work that will be conducted within the facility. Additional information: Funding for this procurement has been secured from the Driving the Electric Revolution (DER) Industrialisation Centres Programme via Innovate UK.
What it takes to wini
How this buyer will score bids.
The evaluation criteria and weights exactly as published on the notice, grouped by family (price, quality, social value and so on).
Evaluation split and conditions of participation as published; the tender pack may add morei
How this buyer will score bids.
The evaluation criteria and weights exactly as published on the notice, grouped by family (price, quality, social value and so on).
Published sub-criteria (2)
- Technical: 70%
- price: 30%
Published award criteria (2)
- Technical: 70
- Price: 30
- Price carries 30 of 100 points: a 10% discount moves about 3 points. The method statement decides this lot, not the discount.
Price arithmetic assumes straight proportional scoring; the tender pack may use another formula.
Procedure terms & legal framework
From the official record · publisher note attached- Procedure method
- Open procedure
- Legal basis
- CELEX · 32014L0024 Public Contracts Regulations 2015 (Directive 2014/24/EU)
- Procurement category
- Goods
- Notice status
- Awarded
- Procurement threshold
- Unspecified in notice
- Regulatory regime
- Standard
- Commercial structure
- Stand-alone contract (no framework)
- Competition type
- Competitive procedure
- GPA / WTO covered
- Yes (GPA)
- Recurring procurement
- No (one-off requirement)
- First published
- 23 Jul 2021, 09:05 BST
- Last source update
- 8 Nov 2021, 15:35 GMT
- Award evaluation window
- 24 Aug 2021 – …
- Authority reference
SU154(21)- FTS notice number
2021/S 000-027974- Classification (CPV)
- Delivery area
- Official registry OCID
ocds-h6vhtk-02cb8fFind a Tender
Publisher note: (WA Ref:115452)
How it was run
Official notice- Submission deadline
- 24 Aug 2021, 12:00 BST
- Submission channel
- {"electronicSubmission"}
- Accepted languages
- en, cy
- Bid validity
- 90 days from the deadline
- Bids opened
- 24 Aug 2021, 12:00 BST
Timeline
24 Aug 2021 → 8 Nov 2021 · 3 dates- Submission deadline24 Aug 2021, 12:00 BST
- Bids opened24 Aug 2021, 12:00 BST
- Notice published8 Nov 2021, 15:35 GMT
Notice history
1 event · 2 releases on Find a Tender- Status changed to complete8 Nov 2021, 15:35 GMT
Commercial outcome & contract awards
Published awards, contracts and bid statistics, not a forecast| Awarded to | Value | Date | Status |
|---|---|---|---|
| Lot 1 · Wafer Dicing System1 award | |||
| Disco HI-TEC UK LTD | £103,982 † | — | Awarded |
| Lot 2 · Wafer Grinding System1 award | |||
| Disco HI-TEC UK LTD | £278,592 † | — | Awarded |
Contracts
Wafer Dicing System · Disco HI-TEC UK LTD
- Signed
- 19 Oct 2021
- Value
- £103,982
- Status
- active
Wafer Grinding System · Disco HI-TEC UK LTD
- Signed
- 19 Oct 2021
- Value
- £278,592
- Status
- active
Bid statistics published by the authority
| Lot | Bids | SME | VCSE | Valid bid range |
|---|---|---|---|---|
| 1 · Wafer Dicing System | 2bids · 2 electronic · 2 from abroad | 0 | — | — |
| 2 · Wafer Grinding System | 1bids · 1 electronic · 1 from abroad | 0 | — | — |
Contracting authority & participating public bodies
Dispute resolution & review bodies
- High CourtReview body
Bidders & participating suppliers
1 commercial party on the notice- Disco HI-TEC UK LTDAwarded supplier
Official documents & specifications
Official links; attachments are not copiedNo document links were published on the notice.