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Official procurement procedure

Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey ITT

Electronic equipment
Semiconductors
Scotland (UKM82)
Published value
Not published
Submission deadline Not published
Lots published1
Procurement Executive Summary
AI & Search Synopsis
Generated from official OCDS record
Tenderline Synopsis: University of Strathclyde: "Supply, Delivery, Installation & Commissioning of a Wafer Thinning Turnkey ITT". Published status: complete. Published value: Value not published. 1 published lot. Submission deadline not published. See the official notice for participation instructions.
Contracting AuthorityUniversity of StrathclydeScope & CategoriesNot publishedSubmission Window
complete
No deadline published
Submission GatewayDirect notice routeLegal Basis & RegimeStandard procurementEstimated Value (exc. VAT)Not published
Bidder Intelligence · Authority Profile: University of Strathclyde
Market Analytics
View Authority Profile →
Derived from OCDS awards & bid statistics
Published history for University of Strathclyde. These figures describe retained records, not a forecast of bids or a measure of buyer bias.
Published-to-award variance
Not availableInsufficient comparable data
Requires at least 5 comparable procedures
Competition Density
2.6Bids / Report
54.9% of reports have one bid
Supplier ConcentrationNo estimate
Insufficient attributable awardsNo concentration estimate available
Payment Terms
Check noticePublished terms
Payment obligations depend on the applicable regime and contract. Consult the official documents.
Coverage: 53 active published awards; 51 bid reports (which may be per lot). Supplier values exclude multi-supplier awards, frameworks and DPS, and use GBP only. They are published award values, not payments. Published-to-award variance compares single-lot, single-award, single-supplier GBP procedures with explicitly non-framework/non-DPS status; increases remain in the average. Unpublished data stays unknown. Awarded suppliers are winners, not all bidders.
Procedure terms
Contracting AuthorityUniversity of Strathclyde
Procedure methodNot published
Procurement categoryNot published
Statuscomplete
Framework / DPSNot published
CompetitionNot published
Above thresholdNot published
Legal basisNot published
Tender period startsNot published
Clarification deadlineNot published
Electronic submissionNot published
Submission languagesNot published
Published13 Aug 2025, 15:38 BST
Last source update13 Aug 2025, 15:38 BST
Recurring procurementNot published
ClassificationElectronic equipment, Semiconductors
Delivery area
Scotland (UKM82)
OCIDocds-h6vhtk-0518c2
What is being bought
The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line. The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. As part of this project, NMIS has a requirement to procure a turnkey capability in wafer thinning, polishing, cleaning - which includes water management ancillary systems. High-efficiency grinder/polisher for wafers A Deionised Water Recycling Unit Automatic Cleaning System for wafers
What changed
From the official release history
  1. tender value changed
    13 Aug 2025, 15:38 BST
  2. Status changed to complete
    13 Aug 2025, 15:38 BST
  3. Official notice release published
    13 Aug 2025, 15:38 BST
  4. Submission deadline changed to published date
    13 Aug 2025, 15:38 BST
  5. Published value updated to £2,000,000
    20 May 2025, 13:42 BST
  6. Status changed to active
    20 May 2025, 13:42 BST
  7. Official notice release published
    20 May 2025, 13:42 BST
  8. Submission deadline changed to 20 Jun 2025, 12:00 BST
    20 May 2025, 13:42 BST
  9. Buyer information updated
    20 May 2025, 13:42 BST
Lots and requirements (1)
Published by the contracting authority
  • Lot 1 · #1
    Individual lot title not published
    cancelled
    Published valueNot published
    The University of Strathclyde has a requirement for a semiconductor wafer thinning capability suitable to receive wafers of various sizes and materials and grind, stress relieve and clean them before onward processing in a power semiconductor packaging line. The line will allow research to be performed on a variety of materials and processes involved in the manufacture of semiconductor products. This is in support of a publicly funded project that will see the creation of an advanced, scaleup packaging facility for power electronics within the National Manufacturing Institute Scotland (NMIS). The overall scale up manufacturing facility is to be housed at an NMIS site, this sub-section of the facility will be housed in an ISO-7 (class 10,000) clean room environment. The equipment within the facility will comprise the latest technology in their respective fields. It will be utilized in a range of projects within the Power Electronics industry and will be made available to both academic and industrial partners across the whole of the United Kingdom, including other catapult centres. As part of this project, NMIS has a requirement to procure a turnkey capability in wafer thinning, polishing, cleaning - which includes water management ancillary systems.
    Contract periodNot published
    EligibilityNot published
    Options / renewalNot published
Timeline
  1. Procedure published
    13 Aug 2025, 15:38 BST
  2. Award active
    Not published · Not published
  3. Contract active
    Signed 30 Jul 2025, 00:00 BST · £1,005,000
Commercial outcome and competition
Awards
Disco Hi-Tech UK Ltd
Not published · Not published · active
Contracts
Contract
£1,005,000 · signed 30 Jul 2025, 00:00 BST · active
Bid statistics
bids: 2 (lot 1)
electronicBids: 2 (lot 1)
foreignBidsFromEU: 2 (lot 1)
foreignBidsFromNonEU: 0 (lot 1)
smeBids: 0 (lot 1)
Buyer and organisations in this procedure

University of Strathclyde

Contracting authority GB-FTS-135284
View buyer profile

  • University of Strathclyde
    buyer
    centralPurchasingBody

    Learning & Teaching Building, 49 Richmond Street, Glasgow, UKM82, G1 1XU
    anna.sanina@strath.ac.uk
    +44 7811592949

  • Disco Hi-Tech UK Ltd
    supplier

    Unit 34, Basepoint Business Centre, Crawley, UK, RH117XX
    +44 1293817730

  • Glasgow Sheriff Court
    reviewBody

    1 Carlton Place, Glasgow, G5 9DA
Documents (0)
Official links; attachments are not copied
No data
No linked documents are published
Related procedures (0)
No data
No related procedures published