Supply, Delivery, Installation and Commissioning of Submicron Flip-Chip Die Bonder

{
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  "date": "2026-08-03T10:18:33+01:00",
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        "description": "Background\nThe UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.\nThe National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.\nNCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore.\nDescription\nThe University of Strathclyde has a requirement for an automatic submicron flip-chip die bonder capable of performing die attachment and flip chip bonding for photonics packaging application.",
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    "title": "Supply, Delivery, Installation and Commissioning of Submicron Flip-Chip Die Bonder",
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      "date": "2026-09-04T12:00:00+01:00"
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      "startDate": "2026-09-04T12:00:00+01:00"
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    "description": "Background\nThe UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.\nThe National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.\nNCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore.\nDescription\nThe University of Strathclyde has a requirement for an advanced Hermetic Sealing capability consisting of Seam Sealing and Projection Welding of hermetic packages used in photonic and advanced semiconductor packaging.",
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        "name": "Anna Sanina",
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  "description": "The buyer is using PCS-Tender to conduct this ITT exercise. The Project code is 32464. For more information see: http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343\nCommunity benefits are included in this requirement. For more information see: https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/\nA summary of the expected community benefits has been provided as follows:\nPlease see Procurement documents for full details\n(SC Ref:818603)\nThe buyer is using PCS-Tender to conduct this ITT exercise. The Project code is 32464. For more information see: http://www.publiccontractsscotland.gov.uk/info/InfoCentre.aspx?ID=2343\nCommunity benefits are included in this requirement. For more information see: https://www.gov.scot/policies/public-sector-procurement/community-benefits-in-procurement/\nA summary of the expected community benefits has been provided as follows:\nPlease see Procurement documents for full details\n(SC Ref:838764)",
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