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Official procurement procedure

Supply, Delivery and Installation of Optical Alignment & Packaging System

Laboratory
optical and precision equipments (excl. glasses)
Scotland (UKM82)
Published value
Not published
Submission deadline 4 Sept 2026, 12:00 BST
Lots published1
Procurement Executive Summary
AI & Search Synopsis
Generated from official OCDS record
Tenderline Synopsis: University of Strathclyde: "Supply, Delivery and Installation of Optical Alignment & Packaging System". Published status: active. Published value: Value not published. 1 published lot. Recorded submission deadline: 4 Sept 2026, 12:00 BST. See the official notice for participation instructions.
Contracting AuthorityUniversity of StrathclydeScope & CategoriesNot publishedSubmission Window
Closed
4 Sept 2026, 12:00 BST
Submission GatewayDirect notice routeLegal Basis & RegimeStandard procurementEstimated Value (exc. VAT)Not published
Bidder Intelligence · Authority Profile: University of Strathclyde
Market Analytics
View Authority Profile →
Derived from OCDS awards & bid statistics
Published history for University of Strathclyde. These figures describe retained records, not a forecast of bids or a measure of buyer bias.
Published-to-award variance
Not availableInsufficient comparable data
Requires at least 5 comparable procedures
Competition Density
2.6Bids / Report
54.9% of reports have one bid
Supplier ConcentrationNo estimate
Insufficient attributable awardsNo concentration estimate available
Payment Terms
Check noticePublished terms
Payment obligations depend on the applicable regime and contract. Consult the official documents.
Coverage: 53 active published awards; 51 bid reports (which may be per lot). Supplier values exclude multi-supplier awards, frameworks and DPS, and use GBP only. They are published award values, not payments. Published-to-award variance compares single-lot, single-award, single-supplier GBP procedures with explicitly non-framework/non-DPS status; increases remain in the average. Unpublished data stays unknown. Awarded suppliers are winners, not all bidders.
Procedure terms
Contracting AuthorityUniversity of Strathclyde
Procedure methodNot published
Procurement categoryNot published
Statusactive
Framework / DPSNot published
CompetitionNot published
Above thresholdNot published
Legal basisNot published
Tender period startsNot published
Clarification deadlineNot published
Electronic submissionNot published
Submission languagesNot published
Published3 Aug 2026, 10:19 BST
Last source update3 Aug 2026, 10:19 BST
Recurring procurementNo
ClassificationLaboratory, optical and precision equipments (excl. glasses)
Delivery area
Scotland (UKM82)
OCIDocds-h6vhtk-06d9a6
What is being bought
Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for optical alignment and packaging system to perform various active and passive alignment functions for photonics packaging applications.
What changed
From the official release history
  1. Status changed to active
    3 Aug 2026, 10:19 BST
  2. Official notice release published
    3 Aug 2026, 10:19 BST
  3. Submission deadline changed to 4 Sept 2026, 12:00 BST
    3 Aug 2026, 10:19 BST
  4. Buyer information updated
    3 Aug 2026, 10:19 BST
Lots and requirements (1)
Published by the contracting authority
  • Lot 1 · #1
    Individual lot title not published
    active
    Published valueNot published
    Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for optical alignment and packaging system to perform various active and passive alignment functions for photonics packaging applications.
    Contract periodNot published
    EligibilityNot published
    Options / renewalNot published
Timeline
  1. Procedure published
    3 Aug 2026, 10:19 BST
  2. Submission deadline
    4 Sept 2026, 12:00 BST
Commercial outcome and competition
AwardsNo award published
ContractsNo contract published
Bid statisticsNo aggregate bid statistics published
Buyer and organisations in this procedure

University of Strathclyde

Contracting authority GB-FTS-135284
View buyer profile
Documents (0)
Official links; attachments are not copied
No data
No linked documents are published
Related procedures (0)
No data
No related procedures published