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Official procurement procedure
Supply, Delivery and Installation of Inductively Coupled Plasma Chemical Vapour Deposition System
Published value
Not published
Submission deadline 9 Sept 2026, 12:00 BST
Lots published1
Procurement Executive Summary
AI & Search Synopsis
Generated from official OCDS record
Tenderline Synopsis: University of Strathclyde: "Supply, Delivery and Installation of Inductively Coupled Plasma Chemical Vapour Deposition System". Published status: active. Published value: Value not published. 1 published lot. Recorded submission deadline: 9 Sept 2026, 12:00 BST. Published submission portal: www.publictendersscotland.publiccontractsscotland.gov.uk.
| Contracting Authority | University of Strathclyde | Scope & Categories | GOODS (1 lot) | Submission Window | 2d 4h left 9 Sept 2026, 12:00 BST |
|---|---|---|---|---|---|
| Submission Gateway | Legal Basis & Regime | 32014L0024 · Open procedure | Estimated Value (exc. VAT) | Not published |
Bidder Intelligence · Authority Profile: University of Strathclyde
Market Analytics
Derived from OCDS awards & bid statistics
Published history for University of Strathclyde. These figures describe retained records, not a forecast of bids or a measure of buyer bias.
Published-to-award variance
Not availableInsufficient comparable data
Competition Density
2.6Bids / Report
Supplier ConcentrationNo estimate
Insufficient attributable awardsNo concentration estimate availablePayment Terms
Check noticePublished terms
Coverage: 53 active published awards; 51 bid reports (which may be per lot). Supplier values exclude multi-supplier awards, frameworks and DPS, and use GBP only. They are published award values, not payments. Published-to-award variance compares single-lot, single-award, single-supplier GBP procedures with explicitly non-framework/non-DPS status; increases remain in the average. Unpublished data stays unknown. Awarded suppliers are winners, not all bidders.
Procedure terms
Contracting AuthorityUniversity of Strathclyde | Procedure methodOpen procedure | Procurement categorygoods |
Statusactive | Framework / DPSNot published | CompetitionNot published |
Above thresholdNot published | Legal basisCELEX · 32014L0024 | Tender period startsNot published |
Clarification deadlineNot published | Electronic submissionNot published | Submission languagesen |
Published6 Aug 2026, 09:01 BST | Last source update6 Aug 2026, 09:01 BST | Recurring procurementNo |
ClassificationLaboratory, optical and precision equipments (excl. glasses) | ||
Delivery area | ||
OCIDocds-h6vhtk-06dd11 | ||
How to participate
Submission method{"electronicSubmission"} | Electronic submissionNot published | Clarification deadlineNot published |
Submission languagesen | Expression of interest deadlineNot published | E-Sourcing Portal |
Submission instructions https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html | ||
What is being bought
Background
The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption.
The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products.
NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore.
Description
The University of Strathclyde has a requirement for an Inductively Coupled Plasma Chemical Vapour Deposition System.
What changed
From the official release history
- Status changed to active
6 Aug 2026, 09:01 BST - Official notice release published
6 Aug 2026, 09:01 BST - Submission deadline changed to 9 Sept 2026, 12:00 BST
6 Aug 2026, 09:01 BST - Buyer information updated
6 Aug 2026, 09:01 BST
Lots and requirements (1)
Published by the contracting authority
- Lot 1 · #1Individual lot title not publishedactiveOptionsRenewalPublished valueNot publishedBackground The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for an Inductively Coupled Plasma Chemical Vapour Deposition System.Contract periodNot publishedEligibilityNot publishedOptions / renewalThe Contracting Authority reserves the right to request additional deliveries by the successful Tenderer, either intended as partial replacement of supplies or installations or as extensions of existing supplies and installations. The Contracting Authority may at it's sole discretion exercise this option. · 12 months (if required maintenance and warranty)
Timeline
- Procedure published
6 Aug 2026, 09:01 BST - Submission deadline
9 Sept 2026, 12:00 BST
Commercial outcome and competition
AwardsNo award published |
ContractsNo contract published |
Bid statisticsNo aggregate bid statistics published |
Buyer and organisations in this procedure
University of Strathclyde
Contracting authority GB-FTS-135284Documents (0)
Official links; attachments are not copied
No linked documents are published
Related procedures (0)
No related procedures published