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planningFind a Tender · planning

Sub-Micron Die Bonder

Buyer: UNIVERSITY OF SHEFFIELD →

BuyerUNIVERSITY OF SHEFFIELD
Statusplanning
DeadlineNot published
Value£380,000
Published9 Dec 2025

What is being bought

We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems.

Delivery location

UKE32, GB

Categories

Laboratory, optical and precision equipments (excl. glasses) 38000000

Lot details

Lot 1

No lot description published.

Statusplanning
Contract periodFrom 2 Mar 2026 to 31 Mar 2026
SME suitabilitySuitable for SMEs

What is included

ItemCategoryQuantity
1Laboratory, optical and precision equipments (excl. glasses)Not published

Comparable-procurement analytics

Benchmarked against retained Find a Tender procedures with CPV division 38. The category anchor is Laboratory, optical and precision equipments (excl. glasses) (38000000); this is a deliberately broad market comparator. The comparison is shown at several levels rather than pretending one company or region is always the best benchmark.

Comparison setProceduresReported bids per procedureNamed award suppliersPrice evidence
Market: CPV division 381,0602 median · 10.7 average (355 of 1,060 with a bid count)3.1 average (402 of 1,060 with named award suppliers)Not published
Same buyer21 median · 1 average (1 of 2 with a bid count)1 average (2 of 2 with named award suppliers)Not published
Delivery region: UKE3273 median · 2.8 average (4 of 7 with a bid count)1 average (4 of 7 with named award suppliers)Not published
Similar published value (0.5×–2×)1243 median · 4 average (3 of 124 with a bid count)1 average (3 of 124 with named award suppliers)Not published

“Reported bids” is an official aggregate, sometimes reported per lot; it is the closest available competition measure. “Named award suppliers” are winners, not all applicants.

Price-outcome signal

Not enough comparable procedures currently publish both a GBP tender value and a usable lowest-valid-bid value to calculate a responsible price-reduction benchmark. Tenderline deliberately does not infer a saving from named award suppliers or from missing award values.

Procurement strategy & market signals

Framework agreementNot published
Dynamic purchasing systemNot published
Competitive procurementNot published
Recurring requirementNot published
Procurement method rationaleNot published
Rationale classificationsNot published
Special regimeNot published
Covered byNot published
Submission policyNot published
Selection criteriaNot published
Risk detailsNot published

Planning & early market engagement

BudgetValue not published
No-engagement rationaleNot published
Planning documents1
Planning milestones1
MilestoneTypeDueStatus
Indicative quotations for budgetary purposes, were sought from two potential providers in November 2025, by one of the academic members of staff team at the University.engagementNot publishedmet

Related procurements

No linked framework, prior procurement or reprocurement published.

Documents & submission route

Source data inventory

Diagnostic view. “Not published” means this current release does not provide a value.

OCIDocds-h6vhtk-05f213
Latest release ID081169-2025
Latest release timestampTue Dec 09 2025 16:09:55 GMT+0000 (Coordinated Universal Time)
Sourcefind-a-tender
Official notice URLNot published
Tender statusplanning
Procurement methodNot published
Procurement method detailsNot published
Main procurement categorygoods
Above thresholdYes
Legal basis2023/54
Tender period: startNot published
Tender period: endNot published
Expression of interest deadlineNot published
Enquiry deadlineNot published
Award period: startNot published
Award period: endNot published
Submission method detailsNot published
Submission languagesNot published
Electronic catalogue policyNot published
Total tender value£380,000
Tender lots in source1
Tender items in source1
Tender documents in source0
Awards in latest release0
Contracts in latest release0
Parties in latest release1

Notice history

DateEventReference
9 Dec 2025planning081169-2025

All source data

Unmodified official OCDS data retained by Tenderline for this procurement process.

Complete current OCDS release JSON
{
  "id": "081169-2025",
  "tag": [
    "planning"
  ],
  "date": "2025-12-09T16:09:55Z",
  "ocid": "ocds-h6vhtk-05f213",
  "buyer": {
    "id": "GB-COH-RC000667",
    "name": "UNIVERSITY OF SHEFFIELD"
  },
  "tender": {
    "id": "4915/DM/25",
    "lots": [
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          "startDate": "2026-03-02T00:00:00Z"
        }
      }
    ],
    "items": [
      {
        "id": "1",
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        "deliveryAddresses": [
          {
            "region": "UKE32",
            "country": "GB",
            "countryName": "United Kingdom"
          }
        ],
        "additionalClassifications": [
          {
            "id": "38000000",
            "scheme": "CPV",
            "description": "Laboratory, optical and precision equipments (excl. glasses)"
          }
        ]
      }
    ],
    "title": "Sub-Micron Die Bonder",
    "value": {
      "currency": "GBP",
      "amountGross": 380000
    },
    "status": "planning",
    "legalBasis": {
      "id": "2023/54",
      "uri": "https://www.legislation.gov.uk/ukpga/2023/54/contents",
      "scheme": "UKPGA"
    },
    "description": "We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems.",
    "communication": {
      "futureNoticeDate": "2025-12-16T23:59:59Z"
    },
    "aboveThreshold": true,
    "mainProcurementCategory": "goods"
  },
  "parties": [
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        "country": "GB",
        "locality": "Sheffield",
        "postalCode": "S10 2TN",
        "countryName": "United Kingdom",
        "streetAddress": "Firth Court, Western Bank"
      },
      "details": {
        "url": "https://www.sheffield.ac.uk/",
        "classifications": [
          {
            "id": "publicAuthoritySubCentralGovernment",
            "scheme": "UK_CA_TYPE",
            "description": "Public authority - sub-central government"
          }
        ]
      },
      "identifier": {
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      },
      "contactPoint": {
        "email": "procurement@sheffield.ac.uk"
      },
      "additionalIdentifiers": [
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  ],
  "language": "en",
  "planning": {
    "documents": [
      {
        "id": "081169-2025",
        "url": "https://www.find-tender.service.gov.uk/Notice/081169-2025",
        "format": "text/html",
        "noticeType": "UK2",
        "description": "Preliminary market engagement notice on Find a Tender",
        "documentType": "marketEngagementNotice",
        "datePublished": "2025-12-09T16:09:55Z"
      }
    ],
    "milestones": [
      {
        "id": "engagement",
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        "dateMet": "2025-11-26T00:00:00Z",
        "description": "Indicative quotations for budgetary purposes, were sought from two potential providers in November 2025, by one of the academic members of staff team at the University."
      }
    ]
  },
  "initiationType": "tender"
}
Complete JSON history (1 releases)
9 Dec 2025 · 081169-2025 · planning
{
  "id": "081169-2025",
  "tag": [
    "planning"
  ],
  "date": "2025-12-09T16:09:55Z",
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          "startDate": "2026-03-02T00:00:00Z"
        }
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    "items": [
      {
        "id": "1",
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        "deliveryAddresses": [
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        ],
        "additionalClassifications": [
          {
            "id": "38000000",
            "scheme": "CPV",
            "description": "Laboratory, optical and precision equipments (excl. glasses)"
          }
        ]
      }
    ],
    "title": "Sub-Micron Die Bonder",
    "value": {
      "currency": "GBP",
      "amountGross": 380000
    },
    "status": "planning",
    "legalBasis": {
      "id": "2023/54",
      "uri": "https://www.legislation.gov.uk/ukpga/2023/54/contents",
      "scheme": "UKPGA"
    },
    "description": "We are seeking equipment that can provide a wide range of bonding technologies to cater for semiconductor die to wafer, die to chip, wafer to wafer, fli-chip and other semiconductor chiplet bonding, to support our work in Heterogeneous Integration for Microelectronics and Semiconductor Systems.",
    "communication": {
      "futureNoticeDate": "2025-12-16T23:59:59Z"
    },
    "aboveThreshold": true,
    "mainProcurementCategory": "goods"
  },
  "parties": [
    {
      "id": "GB-COH-RC000667",
      "name": "UNIVERSITY OF SHEFFIELD",
      "roles": [
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      "address": {
        "region": "UKE32",
        "country": "GB",
        "locality": "Sheffield",
        "postalCode": "S10 2TN",
        "countryName": "United Kingdom",
        "streetAddress": "Firth Court, Western Bank"
      },
      "details": {
        "url": "https://www.sheffield.ac.uk/",
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  ],
  "language": "en",
  "planning": {
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      {
        "id": "081169-2025",
        "url": "https://www.find-tender.service.gov.uk/Notice/081169-2025",
        "format": "text/html",
        "noticeType": "UK2",
        "description": "Preliminary market engagement notice on Find a Tender",
        "documentType": "marketEngagementNotice",
        "datePublished": "2025-12-09T16:09:55Z"
      }
    ],
    "milestones": [
      {
        "id": "engagement",
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        "status": "met",
        "dateMet": "2025-11-26T00:00:00Z",
        "description": "Indicative quotations for budgetary purposes, were sought from two potential providers in November 2025, by one of the academic members of staff team at the University."
      }
    ]
  },
  "initiationType": "tender"
}