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AwardedFind a Tender · award

Silicon Wafers for Test Chips

Buyer: THE OPEN UNIVERSITY →

BuyerTHE OPEN UNIVERSITY
StatusAwarded
DeadlineNot published
ValueValue not published
Published15 Aug 2025

What is being bought

As part of the existing Technology Development Element (TDE) contract with the European Space Agency (ESA), the Open University (OU), in company with Teledyne-e2v, are required to procure and test three experimental test chips for characterisation and testing. Phase 1: To procure Silicon wafers for the manufacture of Front Side Illuminated (FSI) soft X-ray Complementary Metal Oxide Semiconductor (CMOS) imaging detectors to characterise their Electro Optical (EO) performance both pre and post irradiation. Phase 2: A potential second phase subject to funding to process any remaining Silicon wafers from the first phase for the manufacture of Back Side Illuminated (BSI) soft X-ray CMOS imaging detectors to characterise their EO performance both pre and post irradiation. Phase 3: A potential third phase subject to funding to procure Silicon wafers to manufacture another batch of either FSI or BSI soft X-ray CMOS imaging detectors for further characterisation of their EO performance both pre and post irradiation. Cost Phase 1: £220,000 Phase 2: £250,000 Phase 3: £350,00 Total: £820,000

Lot details

Lot LOT-0001

No lot description published.

Statuscomplete

Comparable-procurement analytics

No usable CPV category has been published, so a comparable market set cannot yet be built.

Procurement strategy & market signals

Framework agreementNot published
Dynamic purchasing systemNot published
Competitive procurementNot published
Recurring requirementNot published
Procurement method rationaleThe following conditions are met in relation to the public contract- a) due to an absence of competition for technical reasons, only a particular supplier can supply the goods, services or works required, and b) there are no reasonable alternatives to those goods, services or works. Teledyne-e2v have previously performed a competitor analysis and based on a comparison of price and technical performance, XFAB were selected as the preferred supplier for all their silicon chip products. As a result, Teledyne's CMOS imaging device design and manufacturing plans for this project have been developed to align with XFAB's design rules and processes. Consequently, in order to meet the requirements of the ESA agreement the OU must procure wafers from XFAB to ensure compatibility with Teledyne's design and manufacturing standards.
Rationale classificationssingleSuppliersTechnicalReasons
Special regimeNot published
Covered byNot published
Submission policyNot published
Selection criteriaNot published
Risk detailsNot published

Planning & early market engagement

BudgetNot published
No-engagement rationaleNot published
Planning documents0
Planning milestones0

No planning milestones published.

Related procurements

No linked framework, prior procurement or reprocurement published.

Awards

Contracts

Silicon Wafers for Test Chips

Statusactive
Value€220,000

Documents & submission route

  • Not published

Source data inventory

Diagnostic view. “Not published” means this current release does not provide a value.

OCIDocds-h6vhtk-055960
Latest release ID049225-2025
Latest release timestampFri Aug 15 2025 14:27:18 GMT+0000 (Coordinated Universal Time)
Sourcefind-a-tender
Official notice URLNot published
Tender statuscomplete
Procurement methoddirect
Procurement method detailsDirect award
Main procurement categoryNot published
Above thresholdNot published
Legal basis2023/54
Tender period: startNot published
Tender period: endNot published
Expression of interest deadlineNot published
Enquiry deadlineNot published
Award period: startNot published
Award period: endNot published
Submission method detailsNot published
Submission languagesNot published
Electronic catalogue policyNot published
Total tender valueNot published
Tender lots in source1
Tender items in source0
Tender documents in source1
Awards in latest release1
Contracts in latest release1
Parties in latest release2

Notice history

DateEventReference
15 Aug 2025award, contract049225-2025
4 Jul 2025award, contract037553-2025
4 Jul 2025award, contract037530-2025

All source data

Unmodified official OCDS data retained by Tenderline for this procurement process.

Complete current OCDS release JSON
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Complete JSON history (3 releases)
15 Aug 2025 · 049225-2025 · award, contract
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4 Jul 2025 · 037553-2025 · award, contract
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    },
    {
      "id": "GB-PPON-PLGZ-1483-CXTX",
      "name": "XFAB",
      "roles": [
        "supplier"
      ],
      "address": {
        "region": "MY",
        "country": "MY",
        "locality": "Sarawak",
        "postalCode": "93350",
        "countryName": "Malaysia",
        "streetAddress": "1 Silicon Drive, Sama Jaya Free Industrial Zone, Kuching"
      },
      "details": {
        "url": "https://www.xfab.com/",
        "vcse": false,
        "scale": "large",
        "shelteredWorkshop": false,
        "publicServiceMissionOrganization": false
      },
      "identifier": {
        "id": "PLGZ-1483-CXTX",
        "scheme": "GB-PPON"
      },
      "contactPoint": {
        "email": "KCH-Customer-Service-Group@xfab.com"
      }
    }
  ],
  "language": "en",
  "initiationType": "tender"
}
4 Jul 2025 · 037530-2025 · award, contract
{
  "id": "037530-2025",
  "tag": [
    "award",
    "contract"
  ],
  "date": "2025-07-04T15:42:44+01:00",
  "ocid": "ocds-h6vhtk-055960",
  "buyer": {
    "id": "GB-CHC-RC000391",
    "name": "THE OPEN UNIVERSITY"
  },
  "awards": [
    {
      "id": "1",
      "items": [
        {
          "id": "LOT-0001",
          "relatedLot": "LOT-0001",
          "additionalClassifications": [
            {
              "id": "38000000",
              "scheme": "CPV",
              "description": "Laboratory, optical and precision equipments (excl. glasses)"
            }
          ]
        }
      ],
      "title": "Silicon Wafers for Test Chips ",
      "value": {
        "amount": 820000,
        "currency": "EUR",
        "amountGross": 820000
      },
      "status": "pending",
      "renewal": {
        "description": "Extension End Date:\nPhase 2: March 2028\nPhase 3: September 2029"
      },
      "documents": [
        {
          "id": "037530-2025",
          "url": "https://www.find-tender.service.gov.uk/Notice/037530-2025",
          "format": "text/html",
          "noticeType": "UK5",
          "description": "Transparency notice on Find a Tender",
          "documentType": "awardNotice",
          "datePublished": "2025-07-04T15:42:44+01:00"
        }
      ],
      "suppliers": [
        {
          "id": "GB-PPON-PLGZ-1483-CXTX",
          "name": "X-FAB"
        }
      ],
      "hasRenewal": true,
      "milestones": [
        {
          "id": "1",
          "type": "futureSignatureDate",
          "status": "scheduled",
          "dueDate": "2025-07-17T23:59:59+00:00"
        }
      ],
      "relatedLots": [
        "LOT-0001"
      ],
      "aboveThreshold": true,
      "contractPeriod": {
        "endDate": "2026-01-31T23:59:59+00:00",
        "startDate": "2025-07-18T00:00:00+00:00",
        "maxExtentDate": "2029-09-30T23:59:59+00:00"
      },
      "mainProcurementCategory": "goods"
    }
  ],
  "tender": {
    "id": "OUPA11504",
    "lots": [
      {
        "id": "LOT-0001",
        "status": "complete"
      }
    ],
    "title": "Silicon Wafers for Test Chips ",
    "status": "complete",
    "documents": [
      {
        "id": "conflictOfInterest",
        "description": "Not published",
        "documentType": "conflictOfInterest"
      }
    ],
    "legalBasis": {
      "id": "2023/54",
      "uri": "https://www.legislation.gov.uk/ukpga/2023/54/contents",
      "scheme": "UKPGA"
    },
    "description": "As part of the existing Technology Development Element (TDE) contract with the European Space Agency (ESA), the Open University (OU), in company with Teledyne-e2v, are required to procure and test three experimental test chips for characterisation and testing. \nPhase 1: To procure Silicon wafers for the manufacture of Front Side Illuminated (FSI) soft X-ray Complementary Metal Oxide Semiconductor (CMOS) imaging detectors to characterise their Electro Optical (EO) performance both pre and post irradiation.\nPhase 2: A potential second phase subject to funding to process any remaining Silicon wafers from the first phase for the manufacture of Back Side Illuminated (BSI) soft X-ray CMOS imaging detectors to characterise their EO performance both pre and post irradiation.\nPhase 3: A potential third phase subject to funding to procure Silicon wafers to manufacture another batch of either FSI or BSI soft X-ray CMOS imaging detectors for further characterisation of their EO performance both pre and post irradiation.\nCost\nPhase 1: £220,000\nPhase 2: £250,000\nPhase 3: £350,00\nTotal: £820,000",
    "procurementMethod": "direct",
    "procurementMethodDetails": "Direct award",
    "procurementMethodRationale": "The following conditions are met in relation to the public contract—\na)\tdue to an absence of competition for technical reasons, only a particular supplier can supply the goods, services or works required, and\nb)\tthere are no reasonable alternatives to those goods, services or works.\nTeledyne-e2v have previously performed a competitor analysis and based on a comparison of price and technical performance, XFAB were selected as the preferred supplier for all their silicon chip products. As a result, Teledyne’s CMOS imaging device design and manufacturing plans for this project have been developed to align with XFAB’s design rules and processes. Consequently, in order to meet the requirements of the ESA agreement the OU must procure wafers from XFAB to ensure compatibility with Teledyne’s design and manufacturing standards.",
    "procurementMethodRationaleClassifications": [
      {
        "id": "singleSuppliersTechnicalReasons"
      }
    ]
  },
  "parties": [
    {
      "id": "GB-CHC-RC000391",
      "name": "THE OPEN UNIVERSITY",
      "roles": [
        "buyer"
      ],
      "address": {
        "region": "UKJ12",
        "country": "GB",
        "locality": "Milton Keynes",
        "postalCode": "MK7 6AA",
        "countryName": "United Kingdom",
        "streetAddress": "Walton Hall"
      },
      "details": {
        "classifications": [
          {
            "id": "publicAuthoritySubCentralGovernment",
            "scheme": "UK_CA_TYPE",
            "description": "Public authority - sub-central government"
          }
        ]
      },
      "identifier": {
        "id": "RC000391",
        "scheme": "GB-CHC"
      },
      "contactPoint": {
        "email": "finance-tenders@open.ac.uk"
      }
    },
    {
      "id": "GB-PPON-PLGZ-1483-CXTX",
      "name": "X-FAB",
      "roles": [
        "supplier"
      ],
      "address": {
        "region": "MY",
        "country": "MY",
        "locality": "Sarawak",
        "postalCode": "93350",
        "countryName": "Malaysia",
        "streetAddress": "1 Silicon Drive, Sama Jaya Free Industrial Zone, Kuching"
      },
      "details": {
        "vcse": false,
        "scale": "large"
      },
      "identifier": {
        "id": "PLGZ-1483-CXTX",
        "scheme": "GB-PPON"
      },
      "contactPoint": {
        "email": "michael.rome@xfab.com",
        "telephone": "+6082354888"
      }
    }
  ],
  "language": "en",
  "initiationType": "tender"
}