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active
Official procurement procedure
PURCH2087 PROVISION OF ON-CHIP DEVICE AND INTEGRATED CIRCUIT TEST CLUSTER
Laboratory
optical and precision equipments (excl. glasses)
Published value
Not published
Submission deadline 30 Jun 2022, 12:00 BST
Lots published4
Procurement Executive Summary
AI & Search Synopsis
Generated from official OCDS record
Tenderline Synopsis: University of Glasgow: "PURCH2087 PROVISION OF ON-CHIP DEVICE AND INTEGRATED CIRCUIT TEST CLUSTER". Published status: active. Published value: Value not published. 4 published lots. Recorded submission deadline: 30 Jun 2022, 12:00 BST. See the official notice for participation instructions.
| Contracting Authority | University of Glasgow | Scope & Categories | Not published | Submission Window | Closed 30 Jun 2022, 12:00 BST |
|---|---|---|---|---|---|
| Submission Gateway | Direct notice route | Legal Basis & Regime | Standard procurement | Estimated Value (exc. VAT) | Not published |
Bidder Intelligence · Authority Profile: University of Glasgow
Market Analytics
Derived from OCDS awards & bid statistics
Published history for University of Glasgow. These figures describe retained records, not a forecast of bids or a measure of buyer bias.
Published-to-award variance
Not availableInsufficient comparable data
Competition Density
3Bids / Report
Supplier ConcentrationNo estimate
Insufficient attributable awardsNo concentration estimate availablePayment Terms
Check noticePublished terms
Coverage: 272 active published awards; 272 bid reports (which may be per lot). Supplier values exclude multi-supplier awards, frameworks and DPS, and use GBP only. They are published award values, not payments. Published-to-award variance compares single-lot, single-award, single-supplier GBP procedures with explicitly non-framework/non-DPS status; increases remain in the average. Unpublished data stays unknown. Awarded suppliers are winners, not all bidders.
Procedure terms
Contracting AuthorityUniversity of Glasgow | Procedure methodNot published | Procurement categoryNot published |
Statusactive | Framework / DPSNot published | CompetitionNot published |
Above thresholdNot published | Legal basisNot published | Tender period startsNot published |
Clarification deadlineNot published | Electronic submissionNot published | Submission languagesNot published |
Published30 May 2022, 16:28 BST | Last source update30 May 2022, 16:28 BST | Recurring procurementNo |
ClassificationLaboratory, optical and precision equipments (excl. glasses) | ||
Delivery area | ||
OCIDocds-h6vhtk-0341ae | ||
What is being bought
PURCH2087 PROVISION OF ON-CHIP DEVICE AND INTEGRATED CIRCUIT TEST CLUSTER
Tender documents available from Public Contracts Scotland.
Tender returns should be submitted via Public Contracts Scotland, no paper copies will be accepted. Should paper tenders be submitted, they will be rejected. Further to this any questions or communications regarding individual tender exercises must be sent via the Public Contracts Scotland Portal. Tender queries received through any other channel will not be answered. Should users of Public Contracts Scotland have any problems with the web site they should contact website Support Desk, contact details can be found by following the ‘Contact Us’ option on the left hand menu at http://www.publiccontractsscotland.gov.uk/default.aspx
What changed
From the official release history
- Status changed to active
30 May 2022, 16:28 BST - Official notice release published
30 May 2022, 16:28 BST - Submission deadline changed to 30 Jun 2022, 12:00 BST
30 May 2022, 16:28 BST - Buyer information updated
30 May 2022, 16:28 BST
Lots and requirements (4)
Published by the contracting authority
- Lot 1 · #1Lot 1 – ClusteractivePublished valueNot publishedPURCH2087 PROVISION OF ON-CHIP DEVICE AND INTEGRATED CIRCUIT TEST CLUSTER Lot 1 – Cluster The next generation (6G) that is expected to be commercialized from around 2030 will generate greater diffusion and provide technical platforms to solve social, economic and humanity issues with higher data rates (×50 compared to 5G), wider bandwidth (20 GHz) and lower latency (sub-milliseconds). The urgency and challenges require the development of revolutionary technologies to meet the projected performance levels which are captured in the recent beyond-5G roadmaps by research forums. In this project, we are proposing an on-wafer test cluster that will enable characterisation of chip-level electronic/optoelectronic/photonic devices, circuits, and modules that form the core of 6G and future communication systems operating above 110 GHz with more than 20 GHz bandwidth. Please refer to the Invitation to Tender document for additional information.Contract periodNot publishedEligibilityNot publishedOptions / renewalNot published
- Lot 2 · #2Lot 2 – Load PullactivePublished valueNot publishedPURCH2087 PROVISION OF ON-CHIP DEVICE AND INTEGRATED CIRCUIT TEST CLUSTER Lot 2 – Load Pull The next generation (6G) that is expected to be commercialised from around 2030 will generate greater diffusion and provide technical platforms to solve social, economic and humanity issues with higher data rates (×50 compared to 5G), wider bandwidth (20 GHz) and lower latency (sub-milliseconds). The urgency and challenges require the development of revolutionary technologies to meet the projected performance levels which are captured in the recent beyond-5G roadmaps by research forums. Please refer to the Invitation to Tender document for additional information.Contract periodNot publishedEligibilityNot publishedOptions / renewalNot published
- Lot 3 · #3Lot 3 – Noise ParametersactivePublished valueNot publishedPURCH2087 PROVISION OF ON-CHIP DEVICE AND INTEGRATED CIRCUIT TEST CLUSTER Lot 3 – Noise Parameters The next generation (6G) that is expected to be commercialised from around 2030 will generate greater diffusion and provide technical platforms to solve social, economic and humanity issues with higher data rates (×50 compared to 5G), wider bandwidth (20 GHz) and lower latency (sub-milliseconds). The urgency and challenges require the development of revolutionary technologies to meet the projected performance levels which are captured in the recent beyond-5G roadmaps by research forums. Please refer to the Invitation to Tender document for additional information.Contract periodNot publishedEligibilityNot publishedOptions / renewalNot published
- Lot 4 · #4Lot 4 – Probe StationactivePublished valueNot publishedPURCH2087 PROVISION OF ON-CHIP DEVICE AND INTEGRATED CIRCUIT TEST CLUSTER Lot 4 – Probe Station The next generation (6G) that is expected to be commercialised from around 2030 will generate greater diffusion and provide technical platforms to solve social, economic and humanity issues with higher data rates (×50 compared to 5G), wider bandwidth (20 GHz) and lower latency (sub-milliseconds). The urgency and challenges require the development of revolutionary technologies to meet the projected performance levels which are captured in the recent beyond-5G roadmaps by research forums. Please refer to the Invitation to Tender document for additional information.Contract periodNot publishedEligibilityNot publishedOptions / renewalNot published
Timeline
- Procedure published
30 May 2022, 16:28 BST - Submission deadline
30 Jun 2022, 12:00 BST
Commercial outcome and competition
AwardsNo award published |
ContractsNo contract published |
Bid statisticsNo aggregate bid statistics published |
Buyer and organisations in this procedure
University of Glasgow
Contracting authority GB-FTS-1836Documents (1)
Official links; attachments are not copied
Related procedures (0)
No related procedures published