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NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.

Electronic equipment
Semiconductors
Scotland (UKM82)
Published value
Not published
Submission deadline Not published
Lots published1
Procurement Executive Summary
AI & Search Synopsis
Generated from official OCDS record
Tenderline Synopsis: University of Strathclyde: "NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.". Published status: complete. Published value: Value not published. 1 published lot. Submission deadline not published. See the official notice for participation instructions.
Contracting AuthorityUniversity of StrathclydeScope & CategoriesNot publishedSubmission Window
complete
No deadline published
Submission GatewayDirect notice routeLegal Basis & RegimeStandard procurementEstimated Value (exc. VAT)Not published
Bidder Intelligence · Authority Profile: University of Strathclyde
Market Analytics
View Authority Profile →
Derived from OCDS awards & bid statistics
Published history for University of Strathclyde. These figures describe retained records, not a forecast of bids or a measure of buyer bias.
Published-to-award variance
Not availableInsufficient comparable data
Requires at least 5 comparable procedures
Competition Density
1.8Bids / Report
60% of reports have one bid
Supplier ConcentrationNo estimate
Insufficient attributable awardsNo concentration estimate available
Payment Terms
Check noticePublished terms
Payment obligations depend on the applicable regime and contract. Consult the official documents.
Coverage: 5 active published awards; 5 bid reports (which may be per lot). Supplier values exclude multi-supplier awards, frameworks and DPS, and use GBP only. They are published award values, not payments. Published-to-award variance compares single-lot, single-award, single-supplier GBP procedures with explicitly non-framework/non-DPS status; increases remain in the average. Unpublished data stays unknown. Awarded suppliers are winners, not all bidders.
Procedure terms
Contracting AuthorityUniversity of Strathclyde
Procedure methodNot published
Procurement categoryNot published
Statuscomplete
Framework / DPSNot published
CompetitionNot published
Above thresholdNot published
Legal basisNot published
Tender period startsNot published
Clarification deadlineNot published
Electronic submissionNot published
Submission languagesNot published
Published3 Jul 2024, 12:52 BST
Last source update3 Jul 2024, 12:52 BST
Recurring procurementNot published
ClassificationElectronic equipment, Semiconductors
Delivery area
Scotland (UKM82)
OCIDocds-h6vhtk-03f66f
What is being bought
NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.
What changed
From the official release history
  1. tender value changed
    3 Jul 2024, 12:52 BST
  2. Status changed to complete
    3 Jul 2024, 12:52 BST
  3. Official notice release published
    3 Jul 2024, 12:52 BST
  4. Submission deadline changed to published date
    3 Jul 2024, 12:52 BST
  5. Status changed to active
    20 Dec 2023, 08:57 GMT
  6. Official notice release published
    20 Dec 2023, 08:57 GMT
  7. Submission deadline changed to 5 Feb 2024, 12:00 GMT
    20 Dec 2023, 08:57 GMT
  8. Published value updated to £1,900,000
    23 Aug 2023, 16:15 BST
  9. Status changed to planned
    23 Aug 2023, 16:15 BST
  10. Official notice release published
    23 Aug 2023, 16:15 BST
  11. Buyer information updated
    23 Aug 2023, 16:15 BST
Lots and requirements (1)
Published by the contracting authority
  • Lot 1 · #1
    Individual lot title not published
    cancelled
    Published valueNot published
    NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is able to support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The items procured will enable NMIS to set up a research facility for developing and scaling-up advanced packaging capabilities for power electronic semiconductors. The overall facility will have capability to prepare, dice/cut, bond, interconnect, package and test semiconductor products that are part of the power electronics sector. These stages will be carried out across dedicated research and development cells. The initial focus will be procuring equipment as a 3 cell solution as Cell 6, Cell 7 and Cell 8 of a production line to support die bonding, wire bonding and encapsulation and associated ancillaries required. The University is seeking a supplier to supply, deliver and commission all of the equipment to provide the following overall capability: Cell 6: Die Attach - Automatic die bonding - Vacuum oven curing - Plasma cleaning Cell 7: Interconnection - Multi-head wire bonding - Ultrasonic bonding Cell 8: Encapsulation - Overmoulding - Dam and fill encapsulation - Oven curing
    Contract periodNot published
    EligibilityNot published
    Options / renewalNot published
Timeline
  1. Procedure published
    3 Jul 2024, 12:52 BST
  2. Award active
    Not published · Not published
  3. Contract active
    Signed 24 Jun 2024, 00:00 BST · £1,963,564
Commercial outcome and competition
Awards
Accelonix
Not published · Not published · active
Contracts
Contract
£1,963,564 · signed 24 Jun 2024, 00:00 BST · active
Bid statistics
bids: 1 (lot 1)
electronicBids: 1 (lot 1)
foreignBidsFromEU: 0 (lot 1)
foreignBidsFromNonEU: 1 (lot 1)
smeBids: 1 (lot 1)
Buyer and organisations in this procedure

University of Strathclyde

Contracting authority GB-FTS-74622
View buyer profile

  • University of Strathclyde
    buyer
    centralPurchasingBody

    McCance Building, 16 Richmond Street, Glasgow, UKM82, G1 1QE
    jen.robertson@strath.ac.uk
    +44 7811592949

  • Accelonix
    supplier

    Station Works, Station Road, Linton, UK, CB21 4NW

  • Glasgow Sheriff Court
    reviewBody

    0/1 201 Netherton Road, Glasgow, G13 1B
Documents (0)
Official links; attachments are not copied
No data
No linked documents are published
Related procedures (0)
No data
No related procedures published